Merritronix Ltd

Merritronix Limited was incorporated on the October 14, 1988 as 'Merritronix Private Limited', a Private limited company with the Registrar of Companies, Andhra Pradesh. Subsequently, Company was converted into a Public limited company and the name of the Company was changed to 'Merritronix Limited' upon such conversion dated February 07, 2025 obtained from the Central Registration Centre. Merritronix is an an Electronics Systems Design and Manufacturing services (ESDM) company specializing in high-reliability, mission critical electronic assemblies and systems for defence, aerospace, telecommunications, Rapid Prototyping for design houses OEMs, Engineering services Companies and specialized industrial electronics. They are primarily engaged in electronic manufacturing services, encompassing component sourcing, printed circuit board (PCB) assembly, systems integration, testing, box-build solutions and delivery of finished electronic products - executed to the quality standards required by India's strategic defence and aerospace programmes. A key part of the manufacturing process is Surface-Mount Technology (SMT), which involves assembling electronic components directly onto the surface of printed circuit boards (PCBs) using automated placement systems and controlled reflow processes. The business encompasses a combination of product supply and project-based engineering services and support, to serve complex and high-reliability applications. In 1993, Merritronix shifted its focus to the telecom industry, supplying telecommunication cable jointing kits for India's landline network expansion. In 2006, the Company expanded the operations into the defence and aerospace sectors. In 2007-08, it transitioned towards turnkey manufacturing, providing complete services. In 2012, it undertook a strategic diversification by venturing into turnkey electronics solutions, for assembling, integration and final testing of electronic products. In 2022, Company expanded into the Electronics Component Supply & Obsolescence Management. It began developing custom semiconductor solutions for defence applications including the replacement for obsolete Xilinx CPLDs and Airflow Sensors. The Company has invested in new-generation SMT equipment during FY2025-26, including the Panasonic NPM D3A pick-and-place line commissioned in January 2026. The Company has filed a Draft Prospectus with SEBI& is planning the fresh issue of 47,00,000 equity shares of Rs 10 each through IPO.